SPS is used as a brightening agent in acid copper baths for decorative and functional deposit (i.e. printed circuit boards).SPS is functionally compatible with most components of typical copper bath formulations, such as non-ionic surfactants, polymeric amines and other mercapto compounds.
An additional combination with dyestuffs is also possible. Very good results are obtained if used together with DPS and RALU® 2887.
UPS is used for the deposition of bright, ductile copper coatings in combination with polyethylene glycols and non-ionic surfactants.
The employment of UPS is also possible in other acid electroplating baths for silver and palladium deposition.
RALU® PLATE 2887 is a cross linked polyamide in water and is especially developed for the application in the acid copper bath.
RALU® PLATE 2887 can be diluted with water and is free of organic solvents.
The brightener systems which are produced with RALU® PLATE 2887 are used for decorative and functional plating.
RALUFON® NO14 is used in the plating industry as a carrier and non-ionic tenside for the acid copper bath. RALUFON® NO14 improves the throwing power especially in the low current densities.
Usually RALUFON® NO14 is applied in combination with polyether, thiocompounds and polymeric amines. The copper deposits produced in this way are bright, ductile and leveled. Formulations with RALUFON® NO14 can be used for the production of printed circuit boards and for decorative applications. RALUFON® NO14 is combined very often with SPS and RALU® PLATE 2887.