酸銅光澤劑 ACID COPPER BATHS

SPS

SPS is used as a brightening agent in acid copper baths for decorative and functional deposit (i.e. printed circuit boards).SPS is functionally compatible with most components of typical copper bath formulations, such as non-ionic surfactants, polymeric amines and other mercapto compounds. An additional combination with dyestuffs is also possible. Very good results are obtained if used together with DPS and RALU® 2887.

RASCHIG ELECTROPLATING CHEMICAL

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MPS

In the electroplating industry MPS serves as a brightening agent in acid copper baths to improve the deposition of copper coatings for decorative and functional purposes.

ZPS

ZPS is used as brightening agent in acid electroplating copper baths and has, in combination with polyethers and wetting agents, the effect of depositing a bright and ductile coating.

DPS

DPS is used as brightening agent in acid copper electroplating baths and has, in combination with polyethers and wetting agents, the effect of depositing a bright and ductile coating.

OPX

OPX is used as brightening agent in acid electroplating copper baths and has, in combination with polyethers and wetting agents, the effect of depositing a bright and ductile coating.

UPS

UPS is used for the deposition of bright, ductile copper coatings in combination with polyethylene glycols and non-ionic surfactants. The employment of UPS is also possible in other acid electroplating baths for silver and palladium deposition.

RALU® PLATE 2887

RALU® PLATE 2887 is a cross linked polyamide in water and is especially developed for the application in the acid copper bath. RALU® PLATE 2887 can be diluted with water and is free of organic solvents. The brightener systems which are produced with RALU® PLATE 2887 are used for decorative and functional plating.

RALUFON® NO14

RALUFON® NO14 is used in the plating industry as a carrier and non-ionic tenside for the acid copper bath. RALUFON® NO14 improves the throwing power especially in the low current densities. Usually RALUFON® NO14 is applied in combination with polyether, thiocompounds and polymeric amines. The copper deposits produced in this way are bright, ductile and leveled. Formulations with RALUFON® NO14 can be used for the production of printed circuit boards and for decorative applications. RALUFON® NO14 is combined very often with SPS and RALU® PLATE 2887.

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